Design Change of Open Cavity QFN Package Air Cavity Mirror Semiconductor cavity packages in 2013.

Design Change
Open Cavity
Air Cavity QFN Packages

Open Tooled QFN

Lids

Sockets

Evaluation Kits

Chip Carriers

Assembly

Distributors

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Certain design changes to M-QFN were phased-in: Wall Thickness increase for large packages 6x6mm to 12x12mm for better lid sealing. Die pad size (Dimension E1/D1) slightly decrease for large packages 6x6mm to 12x12mm Plating thickness new G7 plating appears "gold" in color. Original G6 (silver looking color) continues to be available as indicated by the part number suffix. Mold Compound change from G770H to G700L for better cavity sealing.


M-QFN Series - Open Cavity

Top Cavity
G7 Plating

Bottom Side
G7 Plating

Lead Frame:

Copper Lead Frame (C-194 F/H)

Plating: NiPdAu

Available: G7 - Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm

Available: G6 - Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.003 ~ 0.015µm

Phase-out: G5 - Ni 1.27 ~ 4.6µm • Pd 0.15 ~ 0.50µm • Au 0.10 ~ 0.20µm

Wall Thickness Design Change
QFN D/E Size	2012 Original Design Phase-Out	≥2013 New Design	Notes
3mm	0.175mm	0.175mm	No Change
4mm	0.175mm	0.175mm	No Change
5mm	0.175mm	0.175mm	No Change
6mm	0.175mm	0.200mm	Thicker Cavity Wall
7mm	0.175mm	0.225mm	Thicker Cavity Wall
8mm	0.175mm	0.250mm	Thicker Cavity Wall
9mm	0.175mm	0.275mm	Thicker Cavity Wall
10mm	0.175mm	0.300mm	Thicker Cavity Wall
12mm	0.175mm	0.325mm	Thicker Cavity Wall

DAP - Die Pad Dimensions Design Change
QFN D1/E1 Size	2012 Original Design Phase-Out	≥2013 New Design	Notes
3mm	1.4mm	1.4mm	No Change
4mm	2.4mm	2.4mm	No Change
5mm	3.4mm	3.4mm	No Change
6mm	4.4mm	4.35mm	Smaller DAP
7mm	5.4mm	5.3mm	Smaller DAP
8mm	6.0mm	5.85mm	Smaller DAP
9mm	7.0mm	6.8mm	Smaller DAP
10mm	8.0mm	7.75mm	Smaller DAP
12mm	10mm	9.7mm	Smaller DAP

NiPdAu Plating Thickness Design Change
QFN D/E Size	2012 Original Design Phase-Out	≥2013 New Designs	G7 Plating Thickness
3mm	G5 and G6	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
4mm	G5 and G6	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
5mm	G5 and G6	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
6mm	G5 and G6	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
7mm	G5 and G6	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
8mm	G5	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
9mm	G5	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
10mm	G5	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm
12mm	G5	G7	Ni 0.50 ~ 2.0µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm

EME - Mold Compound Change Sumitomo Bakelite Formula
QFN D/E Size	2012 Original Design Phase-Out	≥2013 New Designs	Reason for Change
3mm	G770H	G700L	Improved cavity sealing
4mm	G770H	G700L	Improved cavity sealing
5mm	G770H	G700L	Improved cavity sealing
6mm	G770H	G700L	Improved cavity sealing
7mm	G770H	G700L	Improved cavity sealing
8mm	G770H	G700L	Improved cavity sealing
9mm	G770H	G700L	Improved cavity sealing
10mm	G770H	G700L	Improved cavity sealing
12mm	G770H	G700L	Improved cavity sealing

Mirror Semiconductor
17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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M-QFN have matching footprints to OmPP and OCPP and Open-Pak OCP DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B ,