Die Attach
Application Notes
for Open Cavity QFN
 
 
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Recommended to use either conductive or non-conductive die attach adhesive (according to your application).
Non-Conductive:  Ablebond (Henkel) 84-3 (or equivalent per customer choice)
Conductive:  Ablebond (Henkel) 84-1LMI (or equivalent per customer choice)
Eutective Die Attach is not recommended due to excessively high temperatures.

 

Mirror Semiconductor
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com