M-QFN48T.65-9MM-G7 and M-QFN48W.65-9MM-G7 Open Cavity QFN Wire Bond your die in QFN Package Mirror Semiconductor

M-QFN48W.65-9MM-G7
Open Cavity QFN

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M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Features to suit your specific packaging needs: See our Lids. See All Open Cavity Packages Available

M-QFN48W.65-9MM Open (Air) Cavity QFN
N Leads	P Pitch	D/E Body	D1/E2 Die Pad	Plating Spec	Qty Tray	Part Number	PDF Outline Drawing	Status
44	0.65mm	9mm	7.3mm	G7	16 49 260	M-QFN48W.65-9MM-G7 M-QFN64T.65-9MM-G7 M-QFN64X.65-9MM-G7	464870 464874 464879	Ask

Drawings • CAD Documents Click link to Download File
PDF	DWG Outline	DWG Bond Diagram	DWG PCB Layout	Solidworks easm Model	SAT 3D Model ACIS Spatial

Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version


M-QFN48W.65-9MM Open Cavity
Click Images to Enlarge


Construction: Copper Lead Frame (C-194 F/H) Plating: NiPdAu G7 - Ni 0.50 ~ 2.00µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm Wall Thickness 0.275mm Molding Compound: G700LA

Cavity Package Part Numbering System
M	-	QFN	48	T	.65	-9MM	- G7
Cavity Package		Model	Leads	Packaging	Pitch (mm)	Size (mm)	Plating
M = Molded Plastic Cu Leadframe (C-194F/H)		QFN = Quad Row	48L 9x9mm	W = 2" Tray T = 4" Tray X = JEDEC Tray	0.65mm	9x9mm	G7 NiPdAu Plating Ni 0.50 ~ 2.00µm Pd 0.02 ~ 0.15µm Au 0.025 ~ 0.125µm

Drawing Numbering System
4	6	48	7	4
Package	Pitch	Pins	Plating	Packaging
4 = QFN Quad Sides	6 = 0.65mm	48L 9x9mm	G7 NiPdAu Plating Ni 0.50 ~ 2.00µm Pd 0.02 ~ 0.15µm Au 0.025 ~ 0.125µm	0 = 2" Waffle Tray (W) 4 = 4" Waffle Tray (T) 9 = JEDEC Tray (X)

Flat Lids • Flat Covers
Part Series	B-LID9W-BLACK	T-LID9W-BLACK	T-LID9W-WHITE	G-LID9W-GLASS	EXT9W.8-BLACK
Shape	Flat	Flat	Flat	Flat	Cavity Height Extender
Material	Plastic BT	Plastic BT	Rogers RO4003C	Glass Borosilicate	Plastic BT
Color	Black	Black	White	Clear	Black
D/E Size	9x9mm	9x9mm	9x9mm	9x9mm	9x9mm
Thickness	0.3mm	0.2mm	0.2mm	0.7mm	0.8mm
Attach	Permanent	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent
Sealing Method	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Adhesive Paste
Top View
Bottom View
Rotatable Model	B-LID	T-LID	T-LID	G-LID	EXT
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Dome Lids • Cavity Covers • For Tall Die
Part Series	C-CAP9W-WHITE	G-CAP9W-GLASS	L-CAP9W-BLACK	B-CAP9W-BLACK	Z-CAP9W-ALUMINUM
Shape	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity
Material	Ceramic Alumina 96 Al₂O₃	Glass Borosilicate	LCP Liquid Crystal Polymer	LCP Liquid Crystal Polymer	Aluminum (Al)
Color	White	Clear	Black	Black	Aluminum
D/E Size	9x9mm	9x9mm	9x9mm	9x9mm	9x9mm
I.D. Ceiling Height	0.6mm	0.6mm	0.6mm~ 2.0mm	0.6mm~ 2.0mm	1.2mm
O.D. Outline Height	1.0mm	1.1mm	1.0mm~ 2.5mm	1.0mm~ 2.5mm	1.6mm
B-Stage Preform	None	None	None	Yes	None
Attach	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent	Removable or Permanent
Sealing Method	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste
Top View
Bottom View
Rotatable Model	C-CAP	G-CAP	L-CAP	B-CAP	Z-CAP
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Mirror Semiconductor
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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M-QFN have matching footprints to OmPP and OCPP and Open-Pak OCP DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B ,