M-QFN64T.5-G3 Open Cavity QFN Wire Bond your die in QFN Package Mirror Semiconductor

M-QFN64T.5
Open Cavity QFN

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M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Features to suit your specific packaging needs: See our Lids. See All Open Cavity Packages Available

M-QFN64T.5 Open (Air) Cavity QFN
N Leads	P Pitch	D/E Body	D1/E2 Die Pad	Plating Spec	Qty Tray	Part Number	PDF Outline Drawing	Status
64	0.5mm	9mm	7.0mm	G3	16 25 49	M-QFN64W.5-G3 M-QFN64M.5-G3 M-QFN64T.5-G3	456430 456433 456434	Tooled

Drawings • CAD Documents Click link to Download File
PDF	DXF Outline	DXF Bond Diagram	DXF PCB Layout	Solidworks easm Model	STEP 3D Model

Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version


Photo Examples M-QFN64T.5-G3 Open Cavity
Click Photos to Enlarge

Perspective View
64L 9x9mm
Pitch 0.5mm
NiAu G3

Top Cavity
64L 9x9mm
Pitch 0.5mm
NiAu G3

Bottom View
64L 9x9mm
Pitch 0.5mm
NiAu G3


Construction: Copper Lead Frame (C-194 F/H) Plating: NiAu G3 - Ni 2.50 ~ 7.6µm • Au 1.0 ~ 2.0µm

Cavity Package Part Numbering System
M	-	QFN	64	T	.5	- G3
Cavity Package		Model	Leads	Packaging	Pitch (mm)	Plating
M = Molded Plastic Cu Leadframe (C-194F/H)		QFN = Quad Row	64L 9x9mm	W = 2" Tray T = 4" Tray	0.5mm	NiAu Plating Ni 2.5 ~ 7.6µm Au 1.0 ~ 2.0µm

Drawing Numbering System
4	5	64	3	4
Package	Pitch	Pins	Plating	Packaging
4 = QFN Quad Sides	5 = 0.5mm	64L 9x9mm	NiAu Plating Ni 2.5 ~ 7.6µm Au 1.0 ~ 2.0µm	0 = 2" Waffle Tray (W) 3 = Tube (M) 4 = 4" Waffle Tray (T)

Flat Lids • Flat Covers
Part Series	B-LID9W-BLACK	T-LID9W-BLACK	T-LID9W-WHITE	G-LID9W-GLASS
Shape	Flat	Flat	Flat	Flat
Material	Plastic BT	Plastic BT	Rogers RO4003C	Glass Borosilicate
Color	Black	Black	White	Clear
D/E Size	9x9mm	9x9mm	9x9mm	9x9mm
Thickness	0.3mm	0.2mm	0.2mm	0.7mm
Attach	Permanent	Removable or Permanent	Removable or Permanent	Removable or Permanent
Sealing Method	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste
Top View
Bottom View
Rotatable Model	B-LID	T-LID	T-LID	G-LID
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Dome Lids • Cavity Covers • For Tall Die
Part Series	C-CAP9W-WHITE	G-CAP9W-GLASS	L-CAP9W-BLACK	B-CAP9W-BLACK	Z-CAP9W-ALUMINUM
Shape	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity
Material	Ceramic Alumina 96 Al₂O₃	Glass Borosilicate	LCP Liquid Crystal Polymer	LCP Liquid Crystal Polymer	Aluminum (Al)
Color	White	Clear	Black	Black	Aluminum
D/E Size	9x9mm	9x9mm	9x9mm	9x9mm	9x9mm
I.D. Ceiling Height	0.6mm	0.6mm	0.6mm~ 2.0mm	0.6mm~ 2.0mm	1.2mm
O.D. Outline Height	1.0mm	1.1mm	1.0mm~ 2.5mm	1.0mm~ 2.5mm	1.6mm
B-Stage Preform	None	None	None	Yes	None
Attach	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent	Removable or Permanent
Sealing Method	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste
Top View
Bottom View
Rotatable Model	C-CAP	G-CAP	L-CAP	B-CAP	Z-CAP
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Mirror Semiconductor
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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M-QFN have matching footprints to OmPP and OCPP and Open-Pak OCP DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B ,