M-SOL28M1.27 Wide
Open
 Cavity 28L-SOIC
 
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M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Features to suit your specific packaging needs:
  • See our  Lids.
  • See All  Open Cavity Packages Available
  •  
     
     
    M-SOL28M1.27 Wide Open (Air) Cavity 28L SOIC
    N
    Leads
    P
    Pitch
    D/E
    Body
    D1/E2
    Die Pad
    Plating
    Spec
    Tube
    Qty
    Part Number PDF
    Outline
    Drawing
    Status
    28 1.27mm 7.5 x 18.0mm 4.0 x 5.8mm G3 12 M-SOL28M1.27-G3 120228 Tooled
    28 1.27mm 7.5 x 18.0mm 4.0 X 5.8mm G3 12 M-SOL28M1.27-G3-BARE
    Plastic Die Pad
    Special
    110228 Tooled
     
     
    Drawings • CAD Documents
    Click link to Download File

    Standard
    M-SOL28M1.27-G3

    Special
    M-SOL28M1.27-BARE-G3

    Solidworks
    easm Model
    M-SOL28M1.27-G3
    Standard

    Solidworks
    easm Model
    M-SOL28M1.27-BARE-G3
    Special
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    Download
     
     
     
    M-SOL28M1.27-G3 Open Cavity
    Click Images to Enlarge
     
    Click to Enlarge
    Top
    Cavity View
    28L SOIC Wide
    Pitch 1.27mm
    Click to Enlarge
    SPECIAL
    M-SOL28M1.27-G3-BARE

    BARE DIE PAD
    28L SOIC
    Pitch 1.27mm
    Click to Enlarge
    Bottom View
    28L SOIC Wide
    Pitch 1.27mm
     
    Construction:
  • Copper Lead Frame (A-194 F/H)
  • G3 - Ni 2.5 ~ 7.9µm  • Au 1.27µm
  • Molding Compound: Semiconductor Grade
  •  
     
    Cavity Package Part Numbering System
    M - SOL 28 M 1.27 - G3
    Cavity Package   Model Leads Packaging Pitch (mm) Plating
    M = Molded Plastic
    Cu Leadframe (A-194F/H)
      SOIC
    Small Outline Package
    28L
    7.5 x18mm
    Cav 4.0 x 5.8mm
    Standard:
    M = Tube
    1.27mm G3 NiAu Plating
     
    Flat Lids   •   Flat Covers
    Part Series C-LID-SOL28-BLACK
    Shape Flat
    Material CERAMIC
    Color Black
    Size 7.1 x 12.7mm
    Thickness 0.63~0.75mm
    Attach Permanent
    Sealing
    Method
    LCA-1000
    B-Stage Preform Epoxy
    Top
    View
    Bottom
    View
    Rotatable
    Model
     C-LID-SOL28-BLACK
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    Download
     
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


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