M-SOL28M1.27-G3 Open Cavity SOIC Wire Bond your die in SOIC Package Mirror Semiconductor

M-SOL28M1.27 Wide
Open Cavity 28L-SOIC

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M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Features to suit your specific packaging needs: See our Lids. See All Open Cavity Packages Available

M-SOL28M1.27 Wide Open (Air) Cavity 28L SOIC
N Leads	P Pitch	D/E Body	D1/E2 Die Pad	Plating Spec	Tube Qty	Part Number	PDF Outline Drawing	Status
28	1.27mm	7.5 x 18.0mm	4.0 x 5.8mm	G3	12	M-SOL28M1.27-G3	120228	Tooled
28	1.27mm	7.5 x 18.0mm	4.0 X 5.8mm	G3	12	M-SOL28M1.27-G3-BARE Plastic Die Pad Special	110228	Tooled

Drawings • CAD Documents Click link to Download File
Standard M-SOL28M1.27-G3	Special M-SOL28M1.27-BARE-G3	Solidworks easm Model M-SOL28M1.27-G3 Standard	Solidworks easm Model M-SOL28M1.27-BARE-G3 Special

Install Solidworks e-Drawings software. Required to view rotatable models: Download

Top
Cavity View
28L SOIC Wide
Pitch 1.27mm

SPECIAL
M-SOL28M1.27-G3-BARE
BARE DIE PAD
28L SOIC
Pitch 1.27mm

Bottom View
28L SOIC Wide
Pitch 1.27mm


Construction: Copper Lead Frame (A-194 F/H) G3 - Ni 2.5 ~ 7.9µm • Au 1.27µm Molding Compound: Semiconductor Grade

Cavity Package Part Numbering System
M	-	SOL	28	M	1.27	- G3
Cavity Package		Model	Leads	Packaging	Pitch (mm)	Plating
M = Molded Plastic Cu Leadframe (A-194F/H)		SOIC Small Outline Package	28L 7.5 x18mm Cav 4.0 x 5.8mm	Standard: M = Tube	1.27mm	G3 NiAu Plating

Flat Lids • Flat Covers
Part Series	C-LID-SOL28-BLACK
Shape	Flat
Material	CERAMIC
Color	Black
Size	7.1 x 12.7mm
Thickness	0.63~0.75mm
Attach	Permanent
Sealing Method	LCA-1000 B-Stage Preform Epoxy
Top View
Bottom View
Rotatable Model	C-LID-SOL28-BLACK
Install Solidworks e-Drawings software. Required to view rotatable models: Download

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