NiPdAu
Plating Thickness
 
 More Products    Open Cavity QFN    Lids    Part Number System    Assembly    Distributors    Home  
 

Copper (Cu) leadframe for Open cavity (air cavity) QFN semiconductor packages.

Check chart below for available plating thicknesses.

About G1 (NiPdAu) plating thickness for ceramic package:
  • G1 : Rich Gold plating. Excellent wire bondability. Good reflow SMT.

    • About G3 (NiAu) and G4 (NiPdAu) plating thickness:
  • G3 : Rich Gold plating. Excellent wire bondability. Good reflow SMT. Occasionally subject to black pad phenomena.
  • G4 : Gold plating looks richer. Excellent wire bondability. Good reflow SMT. Seldom subject to black pad phenomena.

    • About G5, G6 and G7 End of Life (EOL):
  • G5 : Gold plating looks richer. Excellent wire bondability. Good reflow SMT. Occasionally subject to black pad phenomena.
  • G6: Thin Gold plating appears silver in color. Excellent bondability. Superior reflow SMT solderability.
  • G7: Gold plating appears gold in color. Excellent bondability. Superior reflow SMT solderability.
    		•
     
    Top Cavity - Click to Enlarge

    G1 Series
    NiPdAu
    Ceramic
  • Ni 3.0 ~ 6µm
  • Pd 0.15 ~ 0.30µm
  • Au 0.03 ~ 0.15µm
    		•  Top Cavity - Click to Enlarge

    G3 Series
    NiAu
  • Ni 2.5 ~ 7.6µm
  • Au 1.0 ~ 2.0µm
    		•  Top Cavity - Click to Enlarge

    G4 Series
    NiPdAu
  • Ni 3.0 ~ 6.0µm
  • Pd 0.05 ~ 0.30µm
  • Au 0.05 ~ 0.15µm
    		•  Top Cavity - Click to Enlarge

    G5 Series
    NiPdAu
  • Ni 1.27 ~ 4.6µm
  • Pd 0.15 ~ 0.50µm
  • Au 0.10 ~ 0.20µm
    		•  Top Cavity - Click to Enlarge

    G7 Series
    NiPdAu
  • Ni 0.50 ~ 2.0µm
  • Pd 0.02 ~ 0.15µm
  • Au 0.025 ~ 0.125µm
    		• Top Cavity - Click to Enlarge

    G6 Series
    NiPdAu
  • Ni 0.50 ~ 2.00µm
  • Pd 0.02 ~ 0.15µm
  • Au 0.003 ~ 0.05µm
    		•
     
    Table 1 - Lead Frame Plating Thickness
    Pins 8L
    DFN    		 10L
    DFN    		 8L
    QFN    		 12L 12L 12L 12L 16L 16L 16L 20L 20L 20L 20L
    Size 3mm 3mm 3mm 3mm 3mm 4mm 4mm 3mm 4mm 5mm 3mm 4mm 5mm 5mm
    Pitch 0.65mm 0.5mm 0.65mm 0.5mm 0.65mm 0.65mm 0.8mm 0.5mm 0.65mm 0.8mm 0.4mm 0.5mm 0.65mm 0.8mm
    Plating G7 G7 G5 G1
    G3
    G4
    G6    		 G3
    G4
    G7    		 G7 G7 G1
    G3    		 G3
    G4
    G5    		 G3
    G4
    G7    		 G7 G1
    G3
    G4
    G5    		 G3
    G4
    G7    		 G7
    Back to M-QFN.
     
     
    Table 2 -Lead Frame Plating Thickness
    Pins 24L 24L 28L 28L 32L 36L 40L 40L 44L 48L 48L 56L 64L 68L 72L 80L
    Size 4mm 5mm 4mm 5mm 5mm 6mm 5mm 6mm 7mm 6mm 7mm 8mm 9mm 10mm 10mm 12mm
    Pitch 0.5mm 0.65mm 0.4mm 0.5mm 0.5mm 0.5mm 0.4mm 0.5mm 0.5mm 0.4mm 0.5mm 0.5mm 0.5mm 0.5mm 0.5mm 0.5mm
    Plating G3
    G4    		 G3
    G4    		 G3
    G4
    G7    		 G3
    G4
    G7    		 G1
    G3
    G4    		 G1
    G3
    G4
    G7    		 G3
    G4
    G5    		 G3
    G4
    G7    		 G1
    G3
    G4    		 G3
    G4    		 G3
    G4    		 G3
    G4
    G7    		 G3
    G4    		 --
    G7    		 G3
    G4    		 G3
    G4
    G7
    Back to M-QFN.
     
     
    Install Solidworks e-Drawings software Version 10.
    Required to view rotatable models:        PC Version
     
     
     
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: +1 (866) 404.8800
    email to Info@MirrorSemi.com


    Top of Page
     
    Back to Products   Home