|
Wire Bondable Die with Perimeter Daisy Chain (Al98% Si1% Cu1%) |
Nbr
Pads |
Bump Matrix |
Pitch |
Die Size
(mm) |
Die
Thickness |
Waffle Tray
Qty |
5" (125mm)
Wafer Qty |
Bondable
Pad |
Order Number |
Ref |
Quick View |
| 48 |
12x12
Perimeter
Daisy Chain |
457µm
18 mil |
6.3mm
250 mil |
610µm
24 mil |
25 Die
2" Tray |
236 Die
5" Wafer |
ø102µm
4 mil |
FCN48G6.3A457-DC |
FBT |
 |
| 64 |
16x16
Perimeter
Daisy Chain |
254µm
10 mil |
5.08mm
200 mil |
610µm
24 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
ø95µm
3.7 mil |
FCN64K5.08A254-DC |
PB10 |
 |
ø118µm
4.6 mil |
FCN64N5.08A254-DC |
ø150µm
6 mil |
FCN64U5.08A254-DC |
| 88 |
22x22
Perimeter
Daisy Chain |
204µm
8 mil |
5.08mm
200 mil |
610µm
24 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
ø80µm
3.1 mil |
FCN88K5.08A204-DC |
PB8 |
 |
ø100µm
4 mil |
FCN88G5.08A204-DC |
| 96 |
24x24
Perimeter
Daisy Chain |
457µm
18 mil |
12.7mm
500 mil |
630µm |
36 Die
4" Tray |
52 Die
5" Wafer |
ø102µm
4 mil |
FC96G12.7A457-DC |
FBT
x4 |
 |
| 112 |
28x28
Perimeter
Daisy Chain |
152µm
6 mil |
5.08mm
200 mil |
610µm
24 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
ø55µm
2.1 mil |
FC112L5A152-DC |
PB6 |
 |
ø86µm
3.3 mil |
FC112K5A152-DC |
□105µm
4 Mil SQ |
FC112K5A152-DC |
| 176 |
44x44
Perimeter
Daisy Chain |
102µm
4 mil |
5.08mm
200 mil |
610µm
24 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
□82µm
3.2 Mil SQ |
FC176J5A102-DC |
PB4 |
 |
Ø56µm
2.2 Mil |
FC176L5A102-DC |
| 176 |
44x44
Perimeter
Daisy Chain |
204µm
8 mil |
10.2mm
400 mil |
610µm
24 mil |
49 die
4" Tray |
81 Die
5" Wafer |
ø102µm
4 mil |
FC176G10C204-DC |
PB8
x4 |
 |
| 220 |
44x66
Perimeter
Daisy Chain |
204µm
8 mil |
10 x 15mm
400x600 mil |
610µm
24 mil |
20 Die
4" Tray |
50 Die
5" Wafer |
ø102µm
4 mil |
FC220G10x15A204-DC |
PB8
x6 |
 |
| 352 |
88x88
Perimeter
Daisy Chain |
102µm
4 mil |
10.16mm
400 mil |
610µm
24 mil |
49 Die
4" Tray |
81 Die
5" Wafer |
□82µm
3.2 Mil SQ |
FC352J10A102-DC |
PB4
4x |
- |
Ø56µm
2.2 Mil |
FC352L10A102-DC |
| Note 1: Die thinning available to 100um (4mil) thick |
| Note 2: Large die with Daisy Chain available: 10mm SQ, 15mm SQ, 20mm SQ, 10x15mm and 15x20mm |
| Note 3: Full Array Daisy Chain die for pad counts up to 8000 pads
| | |
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Stud Bump and Wire Bondable Die with Full Array Daisy Chain (Al98% Si1% Cu1%) |
Nbr
Pads |
Bump Matrix |
Pitch |
Die Size
(mm) |
Die
Thickness |
Bondable
Pad |
Waffle Tray
Qty |
5" (125mm)
Wafer Qty |
Order Number |
Ref |
Quick View |
| 317 |
18x18
Full Array |
254µm
10 mil |
5.08mm
200 mil |
610µm
24 mil |
ø100µm
4 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
FCN317G5.08A254-DC |
FA10
|
 |
| 569 |
24x24
Full Array |
204µm
8 mil |
5.08mm
200 mil |
610µm
24 mil |
ø100µm
4 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
FC569G5.08E204-DC |
FA8
|
 |
| 893 |
30x30
Full Array |
152µm
6 mil |
5.08mm
200 mil |
610µm
24 mil |
ø45µm
4 mil |
36 Die
2" Tray |
340 Die
5" Wafer |
FCN893P5A152-DC |
FA6
|
- |
| 1268 |
36x36
Full Array |
254µm
10 mil |
10.2mm
200 mil |
610µm
24 mil |
ø100µm
4 mil |
49 Die
4" Tray |
340 Die
5" Wafer |
FCN1268G10A254-DC |
FA10
x4 |
 |
| |
|
| Silicon Die with Daisy Chain |
Nbr
Pads |
Description |
Pad Size |
Size (mm) |
Die
Thickness |
Metalization
over SiO2 |
Tray Qty |
Part Number |
Click Photo
to Enlarge |
| 8 pairs |
Daisy Chain |
60 x 160µm |
1.0 x 1.0mm
|
250µm |
Al 1.0µm |
100 |
TD8-1.0-DC
151008 (A2) |
 |
| 16 pairs |
Daisy Chain
32 Wire Bonds |
60 x 160µm |
2.5 x 2.5mm
|
250µm |
Al 1.0µm |
100 |
TD16-2.5-DC
152516 (B2) |
 |
| 24 pairs |
Daisy Chain
48 Wire Bonds |
60 x 360µm |
4.0 x 4.0mm
|
250µm |
Al 1.0µm |
64 |
TD24-4.0-DC
154024 (C3)
8-Inch Wafer
174024
TD24~208
DWG 154000 ALL |
 |
| 64 pairs |
Daisy Chain
128 Wire Bonds |
60 x 360µm |
8.5 x 8.5mm
|
250µm
~725µm |
Al 1.0µm |
49 |
TD64-8-BG725-DC
140064
TD64-8-BG250-DC
150064 |
 |
| 80 pairs |
Daisy Chain
160 Wire Bonds |
60 x 360µm |
12.856 x 12.856mm
|
250µm
~725µm |
Al 1.0µm |
36 |
TD80-12.5-BG250-DC
140080
TD80-12.5-BG725-DC
154080 |
 |
 |
| |
| Silicon Die with Sqaure Pads |
Nbr
Pads |
Description |
Pad Size |
Size (mm) |
Die
Thickness |
Metalization
over SiO2 |
Tray Qty |
Part Number |
Click Photo
to Enlarge |
| 16 |
Square Pad |
60µm SQ. |
1.0 x1.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
100 |
TD16-1.0-ISO
151016 (A1) |
 |
| 32 |
Square Pad |
60µm SQ. |
2.5 x 2.5mm
|
250µm |
Al 1.0µm
Ti 300Å |
100 |
TD32-2.5-ISO
152533 (B1) |
 |
| 48 |
Square Pad |
60µm SQ. |
4.0 x 4.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
64pc 2" tray
196pc 4" Tray |
TD48-4.0-ISO
154048 (C1) |
 |
| 48 |
Square Pad |
100µm SQ. |
4.1 x 4.1mm
|
250µm |
Al 1.0µm
Ti 300Å |
64pc 2" tray
196pc 4" Tray |
TD48-4.1-BG250
2" tray 254148
4" tray 254148
Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244148 |
|
| 96 |
Square Pad |
100µm SQ. |
8.3 x 8.3mm
|
250µm |
Al 1.0µm
Ti 300Å |
49 |
TD96-8.3-BG250
4" tray 208296
Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 248296 |
 |
|
| |
| |
| Silicon Die with Differential Pairs for RF/Microwave Parasitic Test |
Nbr
Pads |
Description |
Pad Size |
Size (mm) |
Die
Thickness |
Metalization
over SiO2 |
Tray Qty |
Part Number |
Click Photo
to Enlarge |
2 Pads
With Ground |
Differential
Pair |
Pad 60 x 160µm
Ground Plane
1000µm SQ. |
1.0 x1.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
100 |
TD2-1.0-DIF
151002 (A3) |
 |
2 Pads
With Ground |
Differential
Pair |
Pad 60 x 160µm
Ground Plane
2500µm SQ. |
2.5 x 2.5mm
|
250µm |
Al 1.0µm
Ti 300Å |
100 |
TD2-2.5-DIF
152502 (B3) |
 |
2 Pads
With Ground |
Differential
Pair |
Pad 60 x 160µm
Ground Plane
4000µm SQ. |
4.0 x 4.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
64 |
TD2-4.0-DIF
151002 (A3) |
 |
|
| |
| |
| Silicon Die with Full Metallization |
Nbr
Pads |
Description |
Pad Size |
Size (mm) |
Die
Thickness |
Metalization
over SiO2 |
Tray Qty |
Part Number |
Click Photo
to Enlarge |
| 1 Large Pad |
Fully Metallized |
1000µm SQ. |
1.0 x1.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
100 |
TD1-1.0-BG250-W
151001 (A4) |
 |
| 1 Large Pad |
Fully Metallized |
1000µm SQ. |
1.0 x1.0mm
|
508µm |
Al 1.0µm
Ti 300Å |
100~400 |
TD1-1.0-BG508-W
251001 |
|
| 1 Large Pad |
Fully Metallized |
1000µm SQ. |
1.0 x1.0mm
|
508µm |
Au 1.0µm
Ti 200Å |
100~400 |
TD1-1.0-Au-BG508-W
351001 |
|
| 1 Large Pad |
Fully Metallized |
1000µm SQ. |
1.0 x1.0mm
|
508µm |
Au 1.0µm
Ti 200Å |
4000
4" wafer |
TD1-1.0-Au-BG508-NH4
361001 |
|
| 1 Large Pad |
Fully Metallized |
1500µm SQ. |
1.5 x1.5mm
|
508µm |
Al 1.0µm
Ti 300Å |
100~169 |
TD1-1.5-BG508-W
251501 |
|
| 1 Large Pad |
Fully Metallized |
2000µm SQ. |
2.0 x2.0mm
|
508µm |
Al 1.0µm
Ti 300Å |
100 |
TD1-2.0-BG508-W
152001 |
|
| 1 Large Pad |
Fully Metallized |
2000µm SQ. |
2.0 x2.0mm
|
508µm |
Au 1.0µm
Ti 200Å |
100 |
TD1-2.0-Au-BG508-W
352001 |
|
| 1 Large Pad |
Fully Metallized |
2000µm SQ. |
2.0 x2.0mm
|
508µm |
Au 1.0µm
Ti 200Å |
1500
4" Wafer |
TD1-2.0-Au-BG508-NH4
362001 |
|
| 1 Large Pad |
Fully Metallized |
2500µm SQ. |
2.5 x 2.5mm
|
250µm |
Al 1.0µm
Ti 300Å |
100 |
TD1-2.5-BG250-W
152501 (B4) |
 |
| 1 Large Pad |
Fully Metallized |
2500µm SQ. |
2.5 x 2.5mm
|
508µm |
Al 1.0µm
Ti 300Å |
100 |
TD1-2.5-BG508-W
252501 |
|
| 1 Large Pad |
Fully Metallized |
3000µm SQ. |
3.0 x 3.0mm
|
508µm |
Al 1.0µm
Ti 300Å |
100 |
TD1-3.0-BG508-W
153001 |
|
| 1 Large Pad |
Fully Metallized |
4000µm SQ. |
4.0 x 4.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
64 |
TD1-4.0-BG250-W
154001 (C4) |
 |
| 1 Large Pad |
Fully Metallized |
4000µm SQ. |
4.0 x 4.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
1500
8" Wafer |
TD1-4.0-BG250-NH8
244001 |
|
| 1 Large Pad |
Fully Metallized |
5000µm SQ. |
5.0 x 5.0mm
|
508µm |
Al 1.0µm
Ti 300Å |
144 |
TD1-5.0-BG508-P
105001 |
|
| 1 Large Pad |
Fully Metallized |
5000µm SQ. |
5.0 x 5.0mm
|
250µm |
Al 1.0µm
Ti 300Å |
1000
8" Wafer |
TD1-5.0-BG250-NH8
245001 |
|
| 1 Large Pad |
Fully Metallized |
5000µm SQ. |
5.0 x 5.0mm
|
508µm |
Al 1.0µm
Ti 300Å |
1000
8" Wafer |
TD1-5.0-BG2508-NH8
145001 |
|
| 1 Large Pad |
Fully Metallized |
6000µm SQ. |
6.0 x 6.0mm
|
200~
725µm |
Al 1.0µm
Ti 300Å |
121 |
TD1-6.0-BG508-P
106001 |
|
| 1 Large Pad |
Fully Metallized |
7000µm SQ. |
7.0 x 7.0mm
|
200~
725µm |
Al 1.0µm
Ti 300Å |
81 |
TD1-7.0-BG508-P
107001 |
|
| 1 Large Pad |
Fully Metallized |
8000µm SQ. |
8.0 x 8.0mm
|
200~
725µm |
Al 1.0µm
Ti 300Å |
64 |
TD1-8.0-BG508-P
108001 |
|
| 1 Large Pad |
Fully Metallized |
10000µm SQ. |
10.0 x 10.0mm
|
200~
725µm |
Al 1.0µm
Ti 300Å |
49 |
TD1-10.0-BG508-P
109901 |
|
| 1 Large Pad |
Fully Metallized |
12000µm SQ. |
12.0 x 12.0mm
|
200~
725µm |
Al 1.0µm
Ti 300Å |
36 |
TD1-12.0-BG508-P
209201 |
|
| 1 Large Pad |
Fully Metallized |
15000µm SQ. |
15.0 x 15.0mm
|
200~
725µm |
Al 1.0µm
Ti 300Å |
25 |
TD1-15.0-BG508-P
209501 |
|
|
Back grind die thickness 200~725um.
Rectangular die available • Custom pad sizes and geometries available.
Packaging Suffix: 2" Waffle Pack (W) • 4" Waffle Pack (P) • Wafer Ring (NT8) • Tape and Reel (E) • JEDEC Tray (T)
Conductive Metallization available: Al, AlS, Al-Si-Cu, Al-Cu, Al-Si, Cu, Ru, Pd, Pt, Au, Ag, Ni, Co, a-Si, and NiSi
Refractory Metallization available: Ta, TaN, Ti, TiN, TiW, W, WN, WSi, Cr |
| |
| |
| Silicon Die with 3-Rows of Bonding Pads |
Total I/O
Pads |
Perimeter
Rows |
Pad Size
µm |
Size (mm) |
Die
Thickness |
Metalization
over SiO2 |
Tray Qty |
Part Number |
Click Photo
to Enlarge |
| 380 |
3-Rows |
50SQ,90SQ
175x55 |
5x3.25mm
|
300,500,750µm |
Al 1.0µm |
144 |
TD380-5x3.2-BG300P
TD380-5x3.2-BG500P
TD380-5x3.2-BG750P |
 |
|
Back grind die thickness 250~750um.
Seed Layer Ti 300Å
Other Sizes available • Custom pad sizes and geometries available.
Packaging Suffix: 2" Waffle Pack (W) • 4" Waffle Pack (P) • Wafer Ring (NT12) • Tape and Reel (E) • JEDEC Tray (T)
Conductive Metallization available: Al, AlS, Al-Si-Cu, Al-Cu, Al-Si, Cu, Ru, Pd, Pt, Au, Ag, Ni, Co, a-Si, and NiSi
Refractory Metallization available: Ta, TaN, Ti, TiN, TiW, W, WN, WSi, Cr |
| |
| |
| JEDEC Moisture Sensitivity Level MSL-1 |
| |
About Dielectric Materials:
Silicon-dioxide insulator SiO2 k = 4.2 • Application: Gold and aluminum wire bonding
Low-k Dielectric k < 3.0 • Application: Copper wire bonding and ultra-fine pitch pads < 90nm
Competing Low-k process technologies:
1) Chemical vapor deposited (CVD) inorganic films such as carbon-doped oxides (SiOC) k~2.8
2) Spun-on dielectrics (SOD) - polymer organic films k 2.5~2.8
Challenge of bonding to pads with Low-k dielectrics:
Spongy dielectric underlayer layer causes top metallization layer to cup and deflect, thus lowering optimal bondability.
|
| Package Selector |
|
Test Die Part Numbering System |
| TD |
16 |
- |
2.5 |
- |
DC |
- |
BG250 |
W |
| Die Type |
Nbr Pads |
|
Die Size (mm) |
|
Patterns |
|
Backgrind
Option |
Packaging
Options |
TD=Singulated Die
TDW = Sawn Wafer
TDWU = Unsawn Wafer
FA = Full Array
Single Die |
1=Fully Plated
2=Differential Pair
3~999=Bond Pads |
|
Square Example
1.0 = 1.0x1.0mm
2.5 = 2.5x2.5mm
4.0 = 4.0x4.0mm
Other sizes available
Rectangular Example:
5x3= X5mm x Y3mm
3x5= X3mm x Y5mm
Other sizes available |
|
DC = Daisy Chain
BUS = Fully Plated
ISO = Isolated Pads
DIF = Differential Pair
FA = Full Array
Blank = Isolated
or Fully Plated |
|
BG### = um thickness
Example:
BG250 = 250um = 10mils
Blank = Undefined |
Single Die:
W = 2" Waffle Pack
P = 4" Waffle Pack
T = JEDEC Tray
E = Tape & Reel
Unsawn Wafer:
C = Cassette
J = Jar/Canister
Sawn Wafer:
NH8 = Plastic Hoop 8" Ring (Non-UV)
UH8 = Plastic Hooop 8" Ring (UV Tape)
NT8 = Dicing Tape 8" Ring
NH8 = Plastic Hoop 8" Ring
NT12 = Dicing Tape 12" Ring
UV8 = UV Tape 8" Ring
UV12 = UV Tape 12" Ring |
|
| Aluminum Pads: 1st Layer: SiO2 - 3000Å • 2nd Layer: Ti - 300Å thick • 3rd Layer: Al - 1.0µm thick • ( 1.0µm = 10000Å = 10KÅ) |
| Copper and other pad platings available |
| DBG: Dice before Gring process available for thin die 50um and 100um thick. |
| Dimensional tolerance: ±5um and ±10um available on request. |
|
Die Daisy Chain Numbering System |
| 1 |
5 |
10 |
08 |
| Variations |
Packaging |
Size |
I/O |
1 = Standard
2~9 = Variations
Thickness
Plating
Materials
etc. |
Single Die:
0 = 4" Waffle Tray (P)
5 = 2" Waffle Tray (W)
Sawn Wafer Disco DTF-2-8-1 Format:
3 = UV Tape & Metal Frame ("UD") FF108 • FF123
4 = Non-UV & Metal Frame ("ND") FF108 • FF123
2 = Non-UV & Plastic Frame ("PD") FFP7290-11
Sawn Wafer K&S 350-104 Format:
1 = UV Tape & Metal Frame ("UK") FF105 • FF123
8 = Non-UV & Metal Frame ("NK") FF105 • FF123
9 = Non-UV & Plastic Frame ("PK") FFP7290-14
6 = Non-UV Wafer Expansion Hoops ("H")
Unsawn Wafer Format:
7 = Clam Shell, Jar, etc |
10 = 1.0x1.0mm
25 = 2.5x2.5mm
40 = 4.0x4.0mm
Other Sizes Available |
01 = 1 pad
08 = 8 pads
16 = 16 pads
24 = 24 pads
48 = 48 pads
99 = 100 pads |
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TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000 • Fax: 1-478-451-3000
Email: sales@topline.tv
©2018 TopLine. All Rights Reserved.
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