Part Numbering System
Open (Air) Cavity QFN Packages
 
 
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Open cavity (air cavity) semiconductor packages for fabless, prototype, probing, pre-production, silicon, MEMS and RF-Microwave applications. Use for R&D, laboratory projects and pre-production.
 
Part Numbering System
Package
M - QFN 16 W .5 - G6
Cavity Type   Model Leads Packaging Pitch (mm) Option
Cavity Package:
M = Cavity 0.6mm Deep

H = Cavity 1.0mm Deep

Molded/Plastic
Cu Leadframe (C-194 F/H)		   QFN = Quad
DFN = Dual		 Number
Pins		 Standard:
W = 2" Waffle
T = 4" Waffle

Optional:
J = JEDEC Tray
M = Tube
 .4
.5
.65
.8		 M-QFN:
G3 = Ni/Au (Thick Gold)

M-QFN and H-QFN:
G6 = Ni/Pd/Au (Thin Gold)
Click Lid part numbering system.
 
 
Drawing Numbering System
Package
   4       5       16       5       0   
Open Cavity
Package		 Pitch Pins Plating & Construction Packaging
4 = QFN
Quad Sides

5 = DFN
Dual Sides		 0 = None
1 = 1.0mm
2 = 1.27mm
3 = 2.54mm
4 = 0.4mm
5 = 0.5mm
6 = 0.65mm
7 = Special
8 = 0.8mm
9 = Special		 3 ~ 88 pins
99 = 100 pins		 Cu Lead Frame:
3=Ni/Au (Thick Gold)

6=NiPdAu (Thin Gold)

 M-QFN:
0 = 2" Waffle Tray (W)
4 = 4" Waffle Tray (T)
3 = Tube (M)

H-QFN:
2 = 2" Waffle Tray (W)
1 = 4" Waffle Tray (T)
 
Packaging Codes
Quantity
QFN
D/E
Size		 W
2" Waffle
Tray		 T
4" Waffle
Tray		 J
JEDEC
Tray
3mm 100 256 490
4mm 64 196 490
5mm 36 144 490
6mm 25 121 260
7mm 25 81 260
8mm 16 64 260
9mm 16 49 260
10mm 9 49 168
12mm 9 36 189
 
Contact:

TopLine Corporation
Tel: 1-800-776-9888
email: info@topline.tv

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