Catalog CTE and Attributes
for Open Cavity QFN
 
 
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M-QFN (Open Cavity QFN)
Material Brand-Moldel Attributes CTE
Molding
Compound		 Sumitomo Bakelite
EME-G700LA		 Dk 4.1
Dielectric Constant tan εr

Df 0.005
Dissipation Factor δ

Tg 125°C

Thermal Conductivity
0.96W/m • °C

Pb Free • Br Free • Sb Free

UL-94 V-0 Class		 α1 = 10x10-6/°C
α2 = 39x10-6/°C
Lead Frame
Base Alloy		 Olin C194 K65

ASTM Mat'l Nbr
C194000		 Cu97.45/Fe2.4/Zn.12/P.3

CuFe2P		 16.7x10-6/°C
@25°C

17.5x10-6/°C
@ 250°C
Surface Treatment
Lead Frame		 Pre-plated
NiPdAu		 Thickness:
Ni 0.50~2.0µm
Pd 0.02~0.15µm
Au 0.003~0.015µm		 Ni 13x10-6/°C
Pd 12x10-6/°C
Au 12x10-6/°C

α @ 25°C
 
Lids
Material Type Dielectric
Constant tan
Dk εr		 Dissipation
Factor
Df δ		 Young's Modulus
GPa @25°C		 CTE
Ceramic Alumina 92%
Black Al2O3		 Dk 9.2 εr
@ 1GHz		 Df 0.0003 δ
@ 1GHz		 275 6.6x10-6/°C
Ceramic Alumina 96%
White Al2O3		 Dk 9.0 εr
@ 1GHz		 Df 0.0002 δ
@ 1GHz		 300 8.2x10-6/°C
Glass Borosilicate Dk 4.6 εr
@ 1MHz		 Df 0.0037 δ
@ 1MHz		 70 3.2x10-6/°C
BT HL832NS
Mitsubishi
Bismaleimide
Triazine		 Dk 4.4 εr
@ 1GHz		 Df 0.006 δ
@ 1GHz		 27 X 11x10-6/°C
Y 11x10-6/°C
Z 25x10-6/°C
Rogers RO4003C
Woven Glass
Ceramic Filled
Thermoset		 Dk 3.38 εr
@ 10GHz		 Df 0.0027 δ
@ 10 GHz		 25 X 11x10-6/°C
Y 14x10-6/°C
Z 46x10-6/°C
LPI E130i
30% Glass Filled
Liquid Crystal
Polymer		 Dk 3.3 εr
@ 1 MHz		 Df 0.025 δ
@ 1 MHz		 13.5 20x10-6/°C
Aluminum Machined Al Dk 1.8 εr
@ 1 MHz		   69 24x10-6/°C


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