M-QFN20W.8-6MM-G7 Open Cavity QFN Wire Bond your die in QFN Package Mirror Semiconductor - 482170, 482174, 482179

M-QFN20W.8-6MM
Open Cavity QFN

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M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Features to suit your specific packaging needs: See our Lids. See All Open Cavity Packages Available

M-QFN Open (Air) Cavity QFN
N Leads	P Pitch	D/E Body	D1/E2 Die Pad	NiPdAu Plating Spec	Tray Qty	Part Number	PDF Outline Drawing	Status
20	0.8mm	6mm	4.5mm	G7	25 121 260	M-QFN20W.8-6MM-G7 M-QFN20T.8-6MM-G7 M-QFN20X.8-6MM-G7	482170 482174 482179	Ask

Drawings • CAD Documents Click link to Download File
PDF	DWG Outline	DWG Bond Diagram	DWG PCB Layout	Solidworks eprt Model	SAT 3D Model ACIS Spatial

Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version


M-QFN20W.8 Open Cavity
Click Images to Enlarge

Perspective View 20L 6x6mm Pitch 0.8mm	Top Cavity 20L 6x6mm Pitch 0.8mm	Bottom View 20L 6x6mm Pitch 0.8mm
Edge View 20L 6x6mm Pitch 0.8mm	Cavity View 20L 6x6mm Pitch 0.8mm	Bottom View 20L 6x6mm Pitch 0.8mm


Construction: Copper Lead Frame (C-194 F/H) Plating: NiPdAu G7 - Ni 0.50 ~ 2.00µm • Pd 0.02 ~ 0.15µm • Au 0.025 ~ 0.125µm Wall Thickness 0.175mm Molding Compound: G700LA

Cavity Package Part Numbering System
M	-	QFN	20	W	.8	-6MM	- G7
Cavity Package		Model	Leads	Packaging	Pitch (mm)	Size	Plating
M = Molded Plastic Cu Leadframe (C-194F/H)		QFN = Quad Row	482170 20L 6x6mm • See 482070 20L 5x5mm	Standard: W = 2" Tray Optional: T = 4" Tray X = JEDEC Tray	.8mm	6x6mm	G7 NiPdAu Plating Ni 0.50 ~ 2.00µm Pd 0.02 ~ 0.15µm Au 0.025 ~ 0.125µm

Drawing Numbering System
4	8	21	7	0
Package	Pitch	Code	Plating	Packaging
4 = QFN Quad Sides	8 = 0.8mm	482170 20L 6x6mm • See 482070 20L 5x5mm	G7 NiPdAu Plating Ni 0.50 ~ 2.00µm Pd 0.02 ~ 0.15µm Au 0.025 ~ 0.125µm	0 = 2" Waffle Tray (W) 4 = 4" Waffle Tray (T) 9 = JEDEC Tray (X)

Flat Lids • Flat Covers
Part Series	B-LID6W-BLACK	T-LID6W-BLACK	T-LID6W-WHITE	G-LID6W-GLASS	EXT6W.8-BLACK
Shape	Flat	Flat	Flat	Flat	Cavity Height Extender
Material	Plastic BT	Plastic BT	Rogers RO4003C	Glass Borosilicate	Plastic BT
Color	Black	Black	White	Clear	Black
D/E Size	6x6mm	6x6mm	6x6mm	6x6mm	6x6mm
Thickness	0.3mm	0.2mm	0.2mm	0.7mm	0.8mm
Attach	Permanent	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent
Sealing Method	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Adhesive Paste
Top View
Bottom View
Rotatable Model	B-LID	T-LID	T-LID	G-LID	EXT
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Dome Lids • Cavity Covers • For Tall Die
Part Series	C-CAP6W-WHITE	G-CAP6W-GLASS	L-CAP6W-BLACK	B-CAP6W-BLACK	Z-CAP6W-ALUMINUM
Shape	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity
Material	Ceramic Alumina 96 Al₂O₃	Glass Borosilicate	LCP Liquid Crystal Polymer	LCP Liquid Crystal Polymer	Aluminum (Al)
Color	White	Clear	Black	Black	Aluminum
D/E Size	6x6mm	6x6mm	6x6mm	6x6mm	6x6mm
I.D. Ceiling Height	0.6mm	0.6mm	0.6mm~ 2.0mm	0.6mm~ 2.0mm	1.2mm
O.D. Outline Height	1.0mm	1.1mm	1.0mm~ 2.5mm	1.0mm~ 2.5mm	1.6mm
B-Stage Preform	None	None	None	Yes	None
Attach	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent	Removable or Permanent
Sealing Method	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste
Top View
Bottom View
Rotatable Model	C-CAP	G-CAP	L-CAP	B-CAP	Z-CAP
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Mirror Semiconductor
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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