M-QFN24W.5-G3 Open Cavity QFN Wire Bond your die in QFN Package Mirror Semiconductor - 452430

M-QFN24T.5
Open Cavity QFN

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M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Features to suit your specific packaging needs: See our Lids. See All Open Cavity Packages

M-QFN24T.5-G3 Open (Air) Cavity QFN
N Leads	P Pitch	D/E Body	D1/E2 Die Pad	Plating Spec	Qty 2" Tray	Qty 4" Tray	Part Number	PDF Outline Drawing	Status
24	0.5mm	4mm	2.4mm	G3	64	196	M-QFN24W.5-G3 M-QFN24T.5-G3	452430 452434	Tooled

Drawings • CAD Documents Click link to Download File
PDF	DXF Outline	DXF Bond Diagram	DXF PCB Layout	Solidworks easm Model

Install Solidworks e-Drawings software. Required to view rotatable models: PC Version


Photo Examples M-QFN24T.5-G3 Open Cavity
Click Photos to Enlarge

Perspective View 24L 4x4mm Pitch 0.5mm G3	Top Cavity 24L 4x4mm Pitch 0.5mm G3	Bottom View 24L 4x4mm Pitch 0.5mm G3
Edge View 24L 4x4mm Pitch 0.5mm G3	Cavity View 24L 4x4mm Pitch 0.5mm G3	Bottom View 24L 4x4mm Pitch 0.5mm G3


Construction: Copper Lead Frame (C-194 F/H) Plating: Ni Au G3 - Ni 2.5 ~ 7.6µm • Au 1.0 ~ 2.0µm

Cavity Package Part Numbering System
M	-	QFN	24	T	.5	- G3
Cavity Package		Model	Leads	Packaging	Pitch (mm)	Plating
M = Molded Plastic Cu Leadframe (C-194F/H)		QFN = Quad Row	24L 4x4mm	Standard: W = 2" Tray Optional: T = 4" Tray	.5mm	G3 Ni 2.5 ~ 7.6µm Au 1.0 ~ 2.0µm

Drawing Numbering System
4	5	24	3	0
Package	Pitch	Pins	Plating	Packaging
4 = QFN Quad Sides	5 = 0.5mm	24L 4x4mm	G3 Ni 2.5 ~ 7.6µm Au 1.0 ~ 2.0µm	0 = 2" Waffle Tray (W) 4 = 4" Waffle Tray (T)

Flat Lids • Flat Covers
Part Series	B-LID4W-BLACK	T-LID4W-BLACK	T-LID4W-WHITE	G-LID4W-GLASS
Shape	Flat	Flat	Flat	Flat	Cavity Height Extender
Material	Plastic BT	Plastic BT	Rogers RO4003C	Glass Borosilicate	Plastic BT
Color	Black	Black	White	Clear	Black
D/E Size	4x4mm	4x4mm	4x4mm	4x4mm	4x4mm
Thickness	0.3mm	0.2mm	0.2mm	0.7mm	0.8mm
Attach	Permanent	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent
Sealing Method	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Adhesive Paste
Top View
Bottom View
Rotatable Model	B-LID	T-LID	T-LID	G-LID	EXT
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

Dome Lids • Cavity Covers • For Tall Die
Part Series	C-CAP4W-WHITE	G-CAP4W-GLASS	L-CAP4W-BLACK	B-CAP4W-BLACK	Z-CAP4W-ALUMINUM
Shape	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity	Dome Cavity
Material	Ceramic Alumina 96 Al₂O₃	Glass Borosilicate	LCP Liquid Crystal Polymer	LCP Liquid Crystal Polymer	Aluminum (Al)
Color	White	Clear	Black	Black	Aluminum
D/E Size	4x4mm	4x4mm	4x4mm	4x4mm	4x4mm
I.D. Ceiling Height	0.6mm	0.6mm	0.6mm~ 2.0mm	0.6mm~ 2.0mm	1.2mm
O.D. Outline Height	1.0mm	1.1mm	1.0mm~ 2.5mm	1.0mm~ 2.5mm	1.6mm
B-Stage Preform	None	None	None	Yes	None
Attach	Removable or Permanent	Removable or Permanent	Removable or Permanent	Permanent	Removable or Permanent
Sealing Method	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	Kapton Tape or Adhesive Paste	LCA3000X B-Stage Preform	Kapton Tape or Adhesive Paste
Top View
Bottom View
Rotatable Model	C-CAP	G-CAP	L-CAP	B-CAP	Z-CAP
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version

Mirror Semiconductor
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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