M-QFN28T.65
Open
 Cavity QFN
 
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M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Features to suit your specific packaging needs:
  • See our  Lids.
  • See All  Open Cavity Packages Available
  •  
     
     
    M-QFN Open (Air) Cavity QFN
    N
    Leads
    P
    Pitch
    D/E
    Body
    D1/E2
    Die Pad
    NiPdAu
    Plating
    Spec
    Tray
    Qty
    Part Number PDF
    Outline
    Drawing
    Status
    28 0.65mm 6mm 4.3mm G3
    G3
    G7
    25
    121
    25
    M-QFN28W.65-G3
    M-QFN28T.65-G3
    M-QFN28W.65-G7
    462830
    462834
    462870
    Tooled
    Tooled
    E.O.L.
     
     
    Drawings • CAD Documents
    Click link to Download File
    PDF-G3

    PDF-G7

    DXF
    Outline-G3

    DXF
    Bond  Diagram-G3

    DXF
    PCB  Layout-G3

    Solidworks-G3
    Solidworks-G7

    SAT 3D Model
    ACIS Spatial
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    PC Version  •  Mac Version
     
     
     
    M-QFN28W.65 Open Cavity
    Click Images to Enlarge
     
    Click to Enlarge
    Perspective View
    28L 6x6mm
    Pitch 0.65mm
    Click to Enlarge
    Top Cavity
    28L 6x6mm
    Pitch 0.65mm
    Click to Enlarge
    Bottom View
    28L 6x6mm
    Pitch 0.65mm
    Click to Enlarge
    Edge View
    28L 6x6mm
    Pitch 0.65mm
    Click to Enlarge
    Cavity View
    28L 6x6mm
    Pitch 0.65mm
    Click to Enlarge
    Bottom View
    28L 6x6mm
    Pitch 0.65mm
     
    Construction:
  • Copper Lead Frame (C-194 F/H)
  • Plating: G3=NiAu or G7=NiPdAu
  • G3 - Ni 2.50 ~ 7.60µm  •  Au 1.0 ~ 2.0µm
  • G7 - Ni 0.50 ~ 2.00µm  • Pd 0.02 ~ 0.15µm  •  Au 0.025 ~ 0.125µm
  • Wall Thickness 0.200mm
  • Molding Compound: G700H
  •  
     
    Cavity Package Part Numbering System
    M - QFN 28 W .65 - G7
    Cavity Package   Model Leads Packaging Pitch (mm) Plating
    M = Molded Plastic
    Cu Leadframe (C-194F/H)
      QFN = Quad Row 28L
    6x6mm
    Standard:
    W = 2" Tray

    Optional:
    T = 4" Tray
    M = TUBE
    .65mm G3 NiAu Plating
    Ni 2.50 ~ 7.60µm
    Au 1.0 ~ 2.0µm

    G7 NiPdAu Plating
    Ni 0.50 ~ 2.00µm
    Pd 0.02 ~ 0.15µm
    Au 0.025 ~ 0.125µm
     
     
    Drawing Numbering System
       4       6       28       7       0   
    Package Pitch Pins Plating Packaging
    4 = QFN
    Quad Sides
    6 = 0.65mm 28L
    6x6mm
    3 = G3 NiAu
    Ni 2.50 ~ 7.60µm
    Au 1.0 ~ 2.0µm

    7 = G7 NiPdAu
    Ni 0.50 ~ 2.00µm
    Pd 0.02 ~ 0.15µm
    Au 0.025 ~ 0.125µm
    0 = 2" Waffle Tray (W)
    4 = 4" Waffle Tray (T)
    3 = TUBE (M)
     
    Flat Lids   •   Flat Covers
    Part Series B-LID6W-BLACK T-LID6W-BLACK T-LID6W-WHITE G-LID6W-GLASS
    Shape Flat Flat Flat Flat
    Material Plastic BT Plastic BT Rogers RO4003C Glass Borosilicate
    Color Black Black White Clear
    D/E Size 6x6mm 6x6mm 6x6mm 6x6mm
    Thickness 0.3mm 0.2mm 0.2mm 0.7mm
    Attach Permanent Removable
    or
    Permanent
    Removable
    or
    Permanent
    Removable
    or
    Permanent
    Sealing
    Method
    LCA3000X
    B-Stage Preform
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    Top
    View
    Bottom
    View
    Rotatable
    Model
     B-LID  T-LID  T-LID  G-LID
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    Download
     
     
    Dome Lids   •   Cavity Covers   •   For Tall Die
    Part Series C-CAP6W-WHITE G-CAP6W-GLASS L-CAP6W-BLACK B-CAP6W-BLACK Z-CAP6W-ALUMINUM
    Shape Dome
    Cavity
    Dome
    Cavity
    Dome
    Cavity
    Dome
    Cavity
    Dome
    Cavity
    Material Ceramic
    Alumina 96
    Al2O3
    Glass
    Borosilicate
    LCP
    Liquid Crystal
    Polymer
    LCP
    Liquid Crystal
    Polymer
    Aluminum
    (Al)
    Color White Clear Black Black Aluminum
    D/E Size 6x6mm 6x6mm 6x6mm 6x6mm 6x6mm
    I.D.
    Ceiling
    Height
    0.6mm 0.6mm 0.6mm~
    2.0mm
    0.6mm~
    2.0mm
    1.2mm
    O.D.
    Outline
    Height
    1.0mm 1.1mm 1.0mm~
    2.5mm
    1.0mm~
    2.5mm
    1.6mm
    B-Stage
    Preform
    None None None Yes None
    Attach Removable
    or
    Permanent
    Removable
    or
    Permanent
    Removable
    or
    Permanent
    Permanent Removable
    or
    Permanent
    Sealing
    Method
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    LCA3000X
    B-Stage Preform
    Kapton Tape
    or Adhesive Paste
    Top
    View
    Bottom
    View
    Rotatable
    Model
      C-CAP   G-CAP   L-CAP   B-CAP   Z-CAP
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    Download
     
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


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