M-QFN40T.4
Open Cavity QFN
 
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M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Features to suit your specific packaging needs:
  • See our  Lids.
  • See All  Open Cavity Packages Available
    •  
     
     
    M-QFN40T.4-G3 (and G5) Open (Air) Cavity QFN
    N
    Leads    		 P
    Pitch    		 D/E
    Body    		 D1/E2
    Die Pad    		 Plating
    Spec    		 Qty
    M-QFN
    2" Tray    		 Part Number PDF
    Outline
    Drawing    		 Rotatable
    360°
    Solidworks
    Model    		 Status
    40 0.4mm 5mm 3.4mm G3 36 M-QFN40T.4-G3 444030 Model Tooled
    40 0.4mm 5mm 3.4mm G5 36 M-QFN40W.4-G5 444050 Model E.O.L
    Install Solidworks e-Drawings software Version 10.
    Required to view rotatable models:        PC Version
     
     
     
     
    Photo Examples M-QFN40W.4-G5 Open Cavity
    Click Photos to Enlarge
     
    Click to Enlarge
    Perspective View
    40L 5x5mm
    Pitch 0.4mm
    G3    		 Click to Enlarge
    Top Cavity
    40L 5x5mm
    Pitch 0.5mm
    G3    		 Click to Enlarge
    Bottom View
    40L 5x5mm
    Pitch 0.4mm
    G3
    Click to Enlarge
    Edge View
    40L 5x5mm
    Pitch 0.4mm
    G3    		 Click to Enlarge
    Cavity View
    40L 5x5mm
    Pitch 0.4mm
    G3    		 Click to Enlarge
    Bottom View
    40L 5x5mm
    Pitch 0.4mm
    G3
     
    Construction:
  • Copper Lead Frame (C-194 F/H)
  • Plating: NiPdAu
  • G3 - Ni 2.5 ~ 7.6µm  •  Au 1.0 ~ 2.0µm
  • G5 - Ni 1.27 ~ 4.57µm  •  Pd 0.15 ~ 0.51µm  •  Au 0.10 ~ 0.20µm
    		•
     
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


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