M-QFN88T.4
Open Cavity QFN
 
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M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Features to suit your specific packaging needs:
  • See our  Lids.
  • See All  Open Cavity Packages Available
    •  
     
     
    M-QFN88T.4 Open (Air) Cavity QFN
    N
    Leads    		 P
    Pitch    		 D/E
    Body    		 D1/E2
    Die Pad    		 Plating
    Spec    		 Qty
    Tray    		 Part Number PDF
    Outline
    Drawing    		 Status
    88 0.4mm 10mm 7.8mm
    8.3mm    		 G3
    G7    		 49
    49    		 M-QFN88T.4-G3
    M-QFN88T.4-G7    		 448830
    448874    		 G3-Tooled
    G7-EOL
     
     
    Drawings • CAD Documents
    Click link to Download File

    PDF-G3
    PDF-G7
    DWG
    Outline
    DWG
    Bond  Diagram
    DWG
    PCB  Layout
    Solidworks
    eprt
    Model
    SAT 3D Model
    ACIS Spatial
    Install Solidworks e-Drawings software.
    Required to view rotatable models:         PC Version  •  Mac Version
     
     
     
    Photo Examples M-QFN88W.4 Open Cavity
    Click Photos to Enlarge
     
    Click to Enlarge
    Perspective View
    88L 10x10mm
    Pitch 0.4mm    		 Click to Enlarge
    Top Cavity
    88L 10x10mm
    Pitch 0.4mm    		 Click to Enlarge
    Bottom View
    88L 10x10mm
    Pitch 0.4mm
    Click to Enlarge
    Edge View
    88L 10x10mm
    Pitch 0.4mm    		 Click to Enlarge
    Cavity View
    88L 10x10mm
    Pitch 0.4mm    		 Click to Enlarge
    Bottom View
    88L 10x10mm
    Pitch 0.4mm
     
    Construction:
  • Copper Lead Frame (C-194 F/H)
  • Plating: NiPdAu
  • G3 - Ni 2.5 ~ 7.6µm  •  Au 1.0 ~ 2.0µm
  • G7 - Ni 0.50 ~ 2.00µm  • Pd 0.02 ~ 0.15µm  • Au 0.025 ~ 0.125µm
  • Cavity Wall: 0.300mm Thick
    		•
     
     
    Cavity Package Part Numbering System
    M - QFN 88 T .4 - G7
    Cavity Package   Model Leads Packaging Pitch (mm) Plating
    M = Molded Plastic
    Cu Leadframe (C-194F/H)    		   QFN = Quad Row 88L
    10x10mm    		 W = 2" Tray
    T = 4" Tray
    M = Tube
    		 0.4mm G3 - NiAu Plating
    Ni 2.5 ~ 7.6µm
    Au 1.0 ~ 2.0µm

    G7 - NiPdAu Plating
    Ni 0.50 ~ 2.00µm
    Pd 0.02 ~ 0.15µm
    Au 0.025 ~ 0.125µm
     
     
    Drawing Numbering System
       4       4       88       7       4   
    Package Pitch Pins Plating Packaging
    4 = QFN
    Quad Sides    		 4 = 0.4mm 88L
    10x10mm    		 G3 - NiAu Plating
    Ni 2.5 ~ 7.6µm
    Au 1.0 ~ 2.0µm

    G7 - NiPdAu Plating
    Ni 0.50 ~ 2.00µm
    Pd 0.02 ~ 0.15µm
    Au 0.025 ~ 0.125µm    		 0 = 2" Waffle Tray (W)
    4 = 4" Waffle Tray (T)
    3 = Tube (M)
     
    Flat Lids   •   Flat Covers
    Part Series B-LID10W-BLACK T-LID10W-BLACK T-LID10W-WHITE G-LID10W-GLASS EXT10W.8-BLACK
    Shape Flat Flat Flat Flat Cavity
    Height Extender
    Material Plastic BT Plastic BT Rogers RO4003C Glass Borosilicate Plastic BT
    Color Black Black White Clear Black
    D/E Size 10x10mm 10x10mm 10x10mm 10x10mm 10x10mm
    Thickness 0.3mm 0.2mm 0.2mm 0.7mm 0.8mm
    Attach Permanent Removable
    or
    Permanent    		 Removable
    or
    Permanent    		 Removable
    or
    Permanent    		 Permanent
    Sealing
    Method    		 LCA3000X
    B-Stage Preform    		 Kapton Tape
    or Adhesive Paste    		 Kapton Tape
    or Adhesive Paste    		 Kapton Tape
    or Adhesive Paste    		 Adhesive Paste
    Top
    View
    Bottom
    View
    Rotatable
    Model    		  B-LID  T-LID  T-LID  G-LID  EXT
    Install Solidworks e-Drawings software.
    Required to view rotatable models:         PC Version  •  Mac Version
     
     
    Dome Lids   •   Cavity Covers   •   For Tall Die
    Part Series C-CAP10W-WHITE G-CAP10W-GLASS L-CAP10W-BLACK B-CAP10W-BLACK Z-CAP10W-ALUMINUM
    Shape Dome
    Cavity    		 Dome
    Cavity    		 Dome
    Cavity    		 Dome
    Cavity    		 Dome
    Cavity
    Material Ceramic
    Alumina 96
    Al2O3    		 Glass
    Borosilicate    		 LCP
    Liquid Crystal
    Polymer    		 LCP
    Liquid Crystal
    Polymer    		 Aluminum
    (Al)
    Color White Clear Black Black Aluminum
    D/E Size 10x10mm 10x10mm 10x10mm 10x10mm 10x10mm
    I.D.
    Ceiling
    Height    		 0.6mm 0.6mm 0.6mm~
    2.0mm    		 0.6mm~
    2.0mm    		 1.2mm
    O.D.
    Outline
    Height    		 1.0mm 1.1mm 1.0mm~
    2.5mm    		 1.0mm~
    2.5mm    		 1.6mm
    B-Stage
    Preform    		 None None None Yes None
    Attach Removable
    or
    Permanent    		 Removable
    or
    Permanent    		 Removable
    or
    Permanent    		 Permanent Removable
    or
    Permanent
    Sealing
    Method    		 Kapton Tape
    or Adhesive Paste    		 Kapton Tape
    or Adhesive Paste    		 Kapton Tape
    or Adhesive Paste    		 LCA3000X
    B-Stage Preform    		 Kapton Tape
    or Adhesive Paste
    Top
    View
    Bottom
    View
    Rotatable
    Model    		   C-CAP   G-CAP   L-CAP   B-CAP   Z-CAP
    Install Solidworks e-Drawings software.
    Required to view rotatable models:         PC Version  •  Mac Version

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


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    M-QFN have matching footprints to OmPP and OCPP and Open-Pak OCP DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B ,