M-QFN88T.4
Open Cavity QFN
 
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M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Features to suit your specific packaging needs:
  • See our  Lids.
  • See All  Open Cavity Packages Available
  •  
     
     
    M-QFN88W.4 Open (Air) Cavity QFN
    N
    Leads
    P
    Pitch
    D/E
    Body
    D1/E2
    Die Pad
    Plating
    Spec
    Qty
    Tray
    Part Number PDF
    Outline
    Drawing
    Status
    88 0.4mm 10mm 8.3mm G7 9
    49
    168
    M-QFN88W.4-G7
    M-QFN88T.4-G7
    M-QFN88X.4-G7
    448870
    448874
    448879
    Tooled
     
     
    Drawings • CAD Documents
    Click link to Download File

    PDF

    DWG
    Outline

    DWG
    Bond  Diagram

    DWG
    PCB  Layout

    Solidworks
    eprt
    Model

    SAT 3D Model
    ACIS Spatial
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    PC Version  •  Mac Version
     
     
     
    Photo Examples M-QFN88W.4 Open Cavity
    Click Photos to Enlarge
     
    Click to Enlarge
    Perspective View
    88L 10x10mm
    Pitch 0.4mm
    Click to Enlarge
    Top Cavity
    88L 10x10mm
    Pitch 0.4mm
    Click to Enlarge
    Bottom View
    88L 10x10mm
    Pitch 0.4mm
    Click to Enlarge
    Edge View
    88L 10x10mm
    Pitch 0.4mm
    Click to Enlarge
    Cavity View
    88L 10x10mm
    Pitch 0.4mm
    Click to Enlarge
    Bottom View
    88L 10x10mm
    Pitch 0.4mm
     
    Construction:
  • Copper Lead Frame (C-194 F/H)
  • Plating: NiPdAu
  • G7 - Ni 0.50 ~ 2.00µm  • Pd 0.02 ~ 0.15µm  • Au 0.025 ~ 0.125µm
  • Cavity Wall: 0.300mm Thick
  •  
     
    Cavity Package Part Numbering System
    M - QFN 88 T .4 - G7
    Cavity Package   Model Leads Packaging Pitch (mm) Plating
    M = Molded Plastic
    Cu Leadframe (C-194F/H)
      QFN = Quad Row 88L
    10x10mm
    W = 2" Tray
    T = 4" Tray
    X = JEDEC Tray
    0.4mm G7 - NiPdAu Plating
    Ni 0.50 ~ 2.00µm
    Pd 0.02 ~ 0.15µm
    Au 0.025 ~ 0.125µm
     
     
    Drawing Numbering System
       4       4       88       7       4   
    Package Pitch Pins Plating Packaging
    4 = QFN
    Quad Sides
    4 = 0.4mm 88L
    10x10mm
    G7 - NiPdAu Plating
    Ni 0.50 ~ 2.00µm
    Pd 0.02 ~ 0.15µm
    Au 0.025 ~ 0.125µm
    0 = 2" Waffle Tray (W)
    4 = 4" Waffle Tray (T)
    9 = JEDEC Tray (X)
     
    Flat Lids   •   Flat Covers
    Part Series B-LID10W-BLACK T-LID10W-BLACK T-LID10W-WHITE G-LID10W-GLASS EXT10W.8-BLACK
    Shape Flat Flat Flat Flat Cavity
    Height Extender
    Material Plastic BT Plastic BT Rogers RO4003C Glass Borosilicate Plastic BT
    Color Black Black White Clear Black
    D/E Size 10x10mm 10x10mm 10x10mm 10x10mm 10x10mm
    Thickness 0.3mm 0.2mm 0.2mm 0.7mm 0.8mm
    Attach Permanent Removable
    or
    Permanent
    Removable
    or
    Permanent
    Removable
    or
    Permanent
    Permanent
    Sealing
    Method
    LCA3000X
    B-Stage Preform
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    Adhesive Paste
    Top
    View
    Bottom
    View
    Rotatable
    Model
     B-LID  T-LID  T-LID  G-LID  EXT
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    PC Version  •  Mac Version
     
     
    Dome Lids   •   Cavity Covers   •   For Tall Die
    Part Series C-CAP10W-WHITE G-CAP10W-GLASS L-CAP10W-BLACK B-CAP10W-BLACK Z-CAP10W-ALUMINUM
    Shape Dome
    Cavity
    Dome
    Cavity
    Dome
    Cavity
    Dome
    Cavity
    Dome
    Cavity
    Material Ceramic
    Alumina 96
    Al2O3
    Glass
    Borosilicate
    LCP
    Liquid Crystal
    Polymer
    LCP
    Liquid Crystal
    Polymer
    Aluminum
    (Al)
    Color White Clear Black Black Aluminum
    D/E Size 10x10mm 10x10mm 10x10mm 10x10mm 10x10mm
    I.D.
    Ceiling
    Height
    0.6mm 0.6mm 0.6mm~
    2.0mm
    0.6mm~
    2.0mm
    1.2mm
    O.D.
    Outline
    Height
    1.0mm 1.1mm 1.0mm~
    2.5mm
    1.0mm~
    2.5mm
    1.6mm
    B-Stage
    Preform
    None None None Yes None
    Attach Removable
    or
    Permanent
    Removable
    or
    Permanent
    Removable
    or
    Permanent
    Permanent Removable
    or
    Permanent
    Sealing
    Method
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    Kapton Tape
    or Adhesive Paste
    LCA3000X
    B-Stage Preform
    Kapton Tape
    or Adhesive Paste
    Top
    View
    Bottom
    View
    Rotatable
    Model
      C-CAP   G-CAP   L-CAP   B-CAP   Z-CAP
    Install Solidworks e-Drawings software.
    Required to view rotatable models:    
    PC Version  •  Mac Version

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


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    M-QFN have matching footprints to OmPP and OCPP and Open-Pak OCP DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B ,